澳洲10开奖官方同步

Wafer processing steps can be separated into four categories: modification of electrical properties, patterning (or lithography), deposition and removal. With more than 300 sequenced processing steps to create a single chip, even if we only applied the four categories to wafer processing equipment, it is actually regrouping a very large number of different processes. It is critical to understand and address each of these processes has a specific requirement in order to provide customized products such as manifold that will allow premium yield and ensure stability in our customer’s process; among these we can  specifically highlight Chemical mechanical planarization (CMP); Wet etching, Electrochemical deposition (ECD), and Cleaning. 

Read our article "Using Manifold Technology in Fluid Systems for Microelectronics Manufacturing" to learn how this technology helps optimize safety, cleanliness and cost of ownership. >>